Diamonex CMP

Unlike conventional conditioners, this all-diamond surface is also chemically inert to all CMP slurries, eliminating grit pullout due to corrosion or wear. In addition, the high-hardness diamond prevents mechanical erosion of bond matrix.

PhoenixTM Product Innovation

Diamonex is introducing the Phoenix product line of CMP conditioner. The Phoenix CMP conditioners are based on a patent-pending ceramic substrate design with optimally selected diamond grit.

Extended Conditioner Life

The Phoenix conditioner’s high working grit percentage results in longer conditioner life and more gradual pad cut rate decay.

Consistent Conditioner Performance

Diamonex utilities advanced quality control systems for raw material selections and process control to provide consistent conditioners, which result in excellent process repeatability. These features enable consistent material removal rate throughout the life of the conditioner and conditioner to conditioner.

Corrosion Resistant Materials

Because the Diamonex Phoenix CMP conditioner embodies pure diamond on a ceramic substrate, it provides optimum compatibility with the wafer fabrication process, virtually eliminating chemical interactions between slurry and conditioner.

Superior Diamond Retention

The CVD diamond deposition process creates a diamond molecular bond between the CVD diamond film, the diamond grit, and the ceramic substrate. This diamond bonding minimizes the possibility of grit pullout and the potential for grit-induced wafer scratches. Degradation of the bond strength from erosion and corrosion does not occur for the Diamonex conditioners because of the high hardness and the inertness of the all-diamond working surface.

Customized Designs

Diamonex offers a variety of conditioner designs including standard 4" and 2" diameter conditioners. Designs are also available for larger diameter ring conditioners, bar conditioners, as well as dual-sided conditioners for hard disk drive manufacturing processes. Customers can order appropriate backing plates designed for drop-in replacement in their platform.

Process Flexibility

Phoenix conditioners with the all-diamond surface can be used ex-situ or in-situ in all CMP processes such as oxide, tungsten, copper, and tantalum.