Diamonex - Diamond Bonding of Grit to Substrate

Diamond-bonding

Diamonex CMP PAD Conditioner Product List
Technical Articles | Diamonex CMP Pad Conditioner Application Form (PDF)

The bond matrix is used to adhere the diamond grit to the substrate surface. Conventional conditioners use metallic bonding. There are four types of metallic bonds: electroplated Nickel, electroless Nickel, brazed, and sintered. One inherent weakness in these bond matrices is their limited hardness resulting in erosion. In addition, all metallic bond matrices are prone to chemical attack and corrosion by low pH slurries. In contrast, Diamonex is the only manufacturer that uses CVD diamond as the bond matrix. This results in superior erosion and corrosion resistance.

Conventional conditioners imbed the diamond grit into the bond matrix, thus limiting the diamond grit protrusion. The Phoenix CVD diamond bond matrix differs in that it encapsulates the diamond grit providing maximum diamond exposure for any given diamond grit size. The CVD process, coupled with DIAMONEX Products' proprietary grit dispersal technology, allows precise control over the grain size and distribution of the deposited diamond film. This in turn provides both flexibility and repeatability in the choice of diamond grit size and density in the preparation of the conditioning disk.

COMPARISON OF DIAMOND GRIT BONDING TECHNIQUES

A Division of Morgan Advanced Ceramics
Morgan Technical Ceramics is a Global Business Unit of the Morgan Crucible Company plc.
It comprises Morgan Advanced Ceramics and Morgan Electro Ceramics.